According to the latest figures, MediaTek has managed to outsell its competitors in the chipset market, an impressive feat.

Should Qualcomm be worried?

MediaTek has confirmed that the Dimensity 9400 will launch later this year where it will be built using TSMC’s 3nm process.

The Qualcomm Snapdragon 8 Gen 3 chipset is 25% more expensive than its predecessor. Could handset makers start looking at alternatives?

The company is planning to expand the reach of its Filogic technologies into four different fields.

It seems that early testing with the X100 has yielded some rather concerning results in terms of performance.

MediaTek has announced yet another chipset, this time in the form of the Dimensity 8300, a slightly less powerful, but still very capable, ...

MediaTek has announced a couple of new chips in the form of the Filogic 860 and Filogic 360 that aims to bring more ...

The debut of the Dimensity 9300 has clearly shown that MediaTek has what it takes to push back towards competitors, although some buyers ...

MediaTek has announced its latest chipset - the Dimensity 9300 - which will challenge the Qualcomm Snapdragon 8 Gen 3 for flagship phones ...

Poised to power a number of flagship Android devices, MediaTek's new chipset is also set to rival the likes of the Qualcomm Snapdragon ...

The launch date was posted by the company's official account on Chinese social media site Weibo.

MediaTek’s chipsets have long been viewed as playing second fiddle to Qualcomm, but if the leaked specs of the Dimensity 9300 are accurate, ...

Specs of MediaTek’s next-gen chipset have leaked, indicating that MediaTek will be focusing on power.

Working together with TSMC, MediaTek has announced the development of their first 3nm chipset.